Features of the course of the solid-state reactions in a Sn/Fe/Cu trilayer film system
Balashov Yu. Yu.
1, Myagkov V. G.
1, Bykova L. E.
1, Volochaev M. N.
1, Zhigalov V. S.
1, Matsynin A. A.
1, Galushka K. A.
2, Bondarenko G. N.
1, Komogortsev S. V.
11Kirensky Institute of Physics, Federal Research Center KSC SB, Russian Academy of Sciences, Krasnoyarsk, Russia
2Siberian Federal University, Krasnoyarsk, Russia
Email: Y.balashov@yandex.ru, lebyk@iph.krasn.ru, volochaev91@mail.ru, zhigalov@iph.krasn.ru, matsyninaa@gmail.com, dir_efir@sfu-kras.ru, komogor@iph.krasn.ru
Study of the mechanisms of the solid-state reactions in Sn/Fe/Cu thin films is interesting both from a fundamental point of view and from a view of the importance of emerging intermetallics in the technology of solder joints and thin-film lithium-ion batteries. By the integrated approach, including both X-ray phase analysis and local elemental analysis of the cross-sections of the films, the phase composition and the mutual arrangement of phases were studied, at various stages of the solid-state reaction occurring at different temperatures. The observed sequence of the appearing phases differs significantly from the expected one if the mass transfer took place by a volume diffusion through the forming layers. Keywords: thin films, transmission electron microscopy, energy dispersion spectroscopy, mass transfer mechanisms. DOI: 10.61011/TP.2023.07.56642.73-23
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