Shestakov D. S.1, Logunov L. S.2, Komlev A. E.
1
1St. Petersburg State Electrotechnical University “LETI", St. Petersburg, Russia
2ITMO University, St. Petersburg, Russia
Email: dishestak@yandex.ru
The development of electronics poses challenges that are difficult to solve using traditional methods, including obtaining metal coatings on a curved surface. One of the methods of solving this problem is presented - laser deposition of metallic copper on a curved glass substrate. A glass cylinder with a radius of 5 mm was selected as a demonstration substrate. The minimum width of the deposited track was 52 μm, the width deviation did not exceed 10% over the entire curved surface.The specific resistance of the track did not exceed 0.6 Ω· mm2· m-1, which allows the method to be used to create copper coatings - components of electronic devices. To demonstrate the capabilities of the method, grids with a cell size of 500 μm were deposited. Keywords: curvilinearity, laser, deposition, metallization.
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Дата начала обработки статистических данных - 27 января 2016 г.