Physics of the Solid State
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The effect of annealing at 450oC on the microstructure of a deformed Cu-1.5Pd-3Ag (at.%)
Novikova O. S. 1, Volkov A. Yu. 1, Korkh Yu. V. 1, Cholakh S. O. 2, Kukharenko A. I. 1,2, Salamatov Yu. A. 1
1M.N. Mikheev Institute of Metal Physics, Ural Branch, Russian Academy of Sciences, Yekaterinburg, Russia
2Ural Federal University after the first President of Russia B.N. Yeltsin, Yekaterinburg, Russia
Email: novikova@imp.uran.ru, volkov@imp.uran.ru, korkh@imp.uran.ru, s.o.cholakh@urfu.ru., a.i.kukharenko@urfu.ru., salamatov@imp.uran.ru

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Experiments were performed in order to study the surface and microstructure of the Cu-1.5Pd-3Ag alloy after deformation and annealing at a temperature of 450oC for 48 hours with air cooling. It is shown that, after this treatment, silver is segregated on the alloy surface in the form of droplet-like particles that are well identified by atomic force microscopy and scanning electron microscopy. The particles lateral sizes are 0.1-0.5 μm, in some cases up to 1 μm. Experiment on X-ray photoelectron spectroscopy indicates that an oxide film with a thickness of no more than 10 nm is formed on the Cu-1.5Pd-3Ag alloy surface, which protects the sample from further oxidation over the its entire volume. According to X-ray diffraction analysis, it was found that, during annealing of the Cu-1.5Pd-3Ag alloy, fractions of two phases with different silver enrichment degrees are segregated: practically pure Ag and a compound close to Ag-31 at.% Pd. Keywords: copper-palladium-silver alloys, microstructure, X-ray diffraction analysis, X-ray photoelectron spectroscopy, scanning electron microscopy, atomic force microscopy.
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