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Patterning approach for detecting defect in device manufacturing

DOI: 10.21883/FTP.2017.12.45192.8203

Vikram Abhishek¹, Agarwal Vineeta¹

¹Deph of Electrical Engineering, MNNIT Allahabad, UP India, E-mail:

Email: vineeta@mnnit.ac.in

Выставление онлайн: 19 ноября 2017 г.

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Compact handheld devices which were a dream in the past are now a reality; this has been enabled by miniaturization of circuit architectures including power devices. Scaling down of the design feature sizes does come with a price with an increase in systematic defects during chip manufacturing. There are generally two methods of inline defect detection adopted to monitor the semiconductor device fabrication - optical inspection and electron beam inspection. The optical inspection uses ultra-violet and deep ultra-violet (UV/DUV) light to find patterning defects on the wafer. While the electron- beam inspection uses electron charge and discharge measurement to find electrical connection defects, both are a costly procedure in terms of resources and time. The physical limit of feature resolution of the optical source is now making the defect inspection job difficult in miniaturized application specific integrated circuit (ASIC). This study is designed to test the patterning optimization approach on both inspection platforms. Using hotspot analysis weak locations are identified in the full chip design, and then they are verified in the inline wafer inspection. The criterion for hot-spot determination is also discussed in this paper. DOI: 10.21883/FTP.2017.12.45192.8203

A. Jain, S.M. Alam, S. Pozder, R.E. Jones. IET on Computers \& Digital Techniques, 5 (3), 169 (2011)
T. Jhaveri, V. Rovner, Lars Liebmann, L. Pileggi, A.J. Strojwas, J.D. Hibbeler. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 29 (4), 509 (2010)
Xu Yang, Li Xin, Hsiung Kan-Lin, S. Boyd et al. Proc. 42nd Design Automation Conf., 2005, p. 632
A.K. Wong. IEEE Design \& Test of Computers, 22 (3), 206 (2005)
A. Burmen, J. Puhan, T. Tuma. 2003 IEEE Intern. Conf. on Industrial Technology, 2 (2), 745 (2003)
Baoxing Duan. IETE Technical Rev. Man ID, 222\_11 (2012)
Kamakoti Veezhinathan. IETE Technical Rev. Man, 241\_11 (2012)
A. Fontanelli, L. Arnone, R. Branca, G. Mastrorocco. IEEE Proc. on Quality Electronic Design (ISQED), 2000, p. 121
Jianliang Li, Qiliang Yan, Lawrence S. Melvin. J. Vacuum Sci. Techn. B: Microelectronics and Nanometer Structures, 26 (5), 1808 (2008)
P. Gupta, A.B. Kahng, Park Chul-Hong, K. Samadi, X. Xu. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 25 (12), 2747 (2006)
Jianliang Li, Lin Zhang, Qiliang Yan, Lawrence S. Melvin, Chadwick Lin, Eason Su, Nail Tang. J. Vacuum Sci. Techn. B: Microelectronics and Nanometer Structures, 28 (6), C619 (2010)
K. Lucas, C.-M. Yuan, R. Boone, K. Wimmer, K. Strozewski, O. Toublan. IEEE Design \& Test of Computers, 23 (1), 30 (2006)
G. Klein, L. Kohler, J. Wiseman, B. Dunham, Anh-Thu Tran, S. Brown, M. Shingo, I. Burki. Intern. Symp. on Semiconductor Manufacturing (ISSM), 2007, p. 1--5
H. Goel, D. Dance. Advanced Semiconductor Manufacturing Conf. and Workshop, 2003. IEEEI/SEMI, 2003, p. 262
S.R. Nassif. Asia and South Pacific Design Automation Conf. (ASPDAC 2008) p. 219
J.C. Le Denmat, V. Charbois, M.C. Luche, G. Kerrien, L. Couturier, L. Karsenti, M. Geshel. Advanced Semiconductor Manufacturing Conf., 2009. IEEE/SEMI, 2009, p. 5
S. Mitra, K. Brelsford, Young Moon Kim, H.-H.K. Lee, Y. Li. IEEE J. Emerging and Selected Topics in Circuits and Systems, 1 (1), 30 (2011)
C. Young, H. Liu, S.F. Tzou, D. Tsui, A. Tsai, E. Chang. Intern. Symp. on Semiconductor Manufacturing (ISSM), 2007, p. 1--3.
Wu Miao, W. Wang, Tian Li, Wu Chunlei, Fan Diwei. IEEE Intern. Conf. on Semiconductor Electronics (ICSE), 2012, p. 440--443
Luo Jianfeng, Su Qing, C. Chiang, J. Kawa. IEEE/ACM Intern. Conf. on Computer-Aided Design, ICCAD-2005, p. 133--140
Hee Lee Jang, Jin Yu Song, Chan Park Sang. IEEE Transactions on Robotics and Automation, 17 (5), 637 (2001)
J.-L. Baltzinger, S. Desmercieres, S. Lasserre, P. Champonnois, M. Mercier. IEEE Conf. and Workshop on Advanced Semiconductor Manufacturing (ASMC '04), 2004, p. 359--366
Willem Van Hans, Kees Van Luttervelt Vliet. Intern. J. Computer Integrated Manufacturing, 17 (3), 224 (2004)
S. Vinodh, D. Rajanayagam. Intern. J. Sustainable Engineering, 3 (4), 292 (2010)

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